| Board
Features |
Standard
|
Premium
|
Advanced
|
Future |
| Lines and Spaces (Outer) |
0.006" |
.005"-.003" |
.0025" |
|
| Lines and Spaces (Inner) |
0.006" |
.005"-.003" |
.0025" |
|
| Outer Annual Ring |
0.007" |
.006"-.004" |
.003" |
|
| Inner Annual Ring |
0.007" |
.006"-.004" |
.003" |
|
| Hole to Plane Clearance or
Conductor |
0.014" |
0.011" |
0.008" |
|
Layer to Layer Registration
(Core to Core) |
0.005" |
0.004" |
0.003" |
|
Layer to Layer
Registration
(Top to Bottom) |
0.005" |
.004"-.003" |
0.002" |
|
| PCB Thickness Tolerance |
10% |
9 -
5% |
0.002" |
|
| Mechanical Drill Hole Minimum |
0.016" |
.0145"-.008" |
0.006 |
|
| Laser Drilled Holes |
0.006" |
0.004" |
0.003" |
|
| Controll Depth Drill Aspect
Ratio |
0.8:1 |
1:1 |
1:1 |
|
| Drill size Aspect Ratio |
7:1 |
8:1 -
10:1 |
11:1 -
15:1 |
|
| Controlled Impedance
Characteristic |
10% |
9 -
7% |
5% |
|
| LPI Soldermask (Dams) |
0.005" |
0.004" |
0.003" |
|
| Layer Count |
20+ |
|
|
|
| Panel Sizes: |
12 X
18 |
|
|
|
| |
16 X
18 |
|
|
|
| |
18 X
24 |
|
|
|
| |
20 X
26 |
|
|
|
| Maximum Board Thickness |
0.300" |
|
|
|
| Minimum Board Thickness |
0.010" |
|
|
|
| |
|
|
|
|
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